San Diego, CA – March 8, 2006 – Advanced Applied Adhesives (AAA) today announced the availability in production quantities of a new series of electrically insulating die attach adhesives featuring a low coefficient of thermal expansion (CTE) that reduces CTE strain. Designated AAA2300, the series is comprised of AAA2300, AAA2301 and AAA2303.

Low bleed in nature, AAA2300 is suitable for pyramidal-die-stack on bleed-prone nitride passivated die that is without polyimide final passivation. Designed for a 1 mil or thinner bondline, the ultra fine silica filler in AAA2300 has been proven to not damage the bottom die; even without the polyimide buffer layer.

The lower CTE AAA2301 and AAA2303 are for same-die-stack applications requiring a gap filling bondline in place of a dummy die. The materials fill the gap all the way to the die edge to provide firm support to the top die for wire bonding. The low CTE of the materials protects bonding wires from breaking in temperature cycling and thermal shock. Lower in density, the AAA2301 has a price advantage on a per volume basis while AAA2303, having the lowest CTE among the 2300 series, endures extended cycles of thermal
stresses without early fallouts.

Each adhesive in the series is solvent-free and will cure to a void-free bondline in a fast ramp, snap cure oven or in a box oven for batch processing.

Commenting on this latest entry, Frank Husson, AAA’s president, stated, “This series of adhesives is designed to offer lower cost and higher reliability than other adhesive technologies in a cost sensitive product. It is yet another innovative addition to our portfolio of products that result in lower costs, higher yields, and improved quality for the semiconductor industry.”

Advanced Applied Adhesives was founded in 2002 by Mr. Husson to manufacture and market die attach adhesives and specialty materials for the microelectronics industry. The company occupies a 32,000 square foot facility in San Diego that had previously been Honeywell Incorporated’s Advanced Polymer Operation. The building has Class 1,000-100,000 clean rooms and production areas with extensive production and analytical equipment for volume manufacturing of precious metal powders, proprietary polymers and specialty adhesives.

Advanced Applied Adhesives has a strategic alliance with Designer Molecules, Inc. (DMI), a sister company with common ownership. Also founded by Mr. Husson in 2001, DMI’s business model is focused on the design and licensing of unique molecules, including adhesive molecules for specific customer requirements. DMI’s co-founder, Dr. Stephen Dershem, a key inventor of the first BMI liquid monomer, is also a principal of the company.

For more information the AAA2300 series, call (858) 348-1125 or email info@appliedadhesives.com.