Known
as the most significant exhibition specialised in IC
Final Manufacturing, (assembly, test and packaging),
ICP 2006 was grandly held from January 18-20, 2006 at
Tokyo Big Sight. ICP - IC
PACKAGING TECHNOLOGY EXPO once again
proved its reputation as the most effective and most
crowded trade show in the semiconductor industry, an
enormous number of industry professionals lined up at
the Registration Counter all 3 days.
According to the report announced by Show Management,
46,542* industry professionals visited this year.
Expanding
30% of its size, ICP has been showing remarkable growth,
and is now established as Japan's largest exhibition
gathering various equipment, materials, components,
services for IC back-end manufacturing. Visitors from
Japan, Korea, Taiwan, China, Singapore, USA and other
regions came to discuss to and to compare the most advanced
equipment with industry leading exhibitors for their
installation.
Exhibitors include Disco,
Canon Machinery, Acro Metrix, Techno Alpha, PAC TECH,
Samsung Electro-Mechanics, NAMICS, HITACHI CHEMICALS,
SUMITOMO BAKELITE, EASTERN, ABLESTIK, Kyocera Chemicals,
Tokyo Ohka, Nagase, etc.
The "Subcontractor Zone" again featured
the industry's TOP companies - Amkor,
Renesas, SPIL, STATS ChipPAC, Fujitsu IMT, Casio Micronics,
Oki, TESSERA, KYEC (King Yuan Electronics),
etc. Followed by the strong needs of Japanese Semiconductors,
these subcontractors gathered enormous attention. In
the 2007 event, many more companies are expected to
join.
Another zone, the "Plating/Etching Zone"
also featured industry leaders --
ROHM AND HAAS, ATOTECH JAPAN, APPLIED FILMS, C.UYEMURA,
Hirai Seimitsu Kogyo, Ebara-Udylite,
etc. exposing their unique technologies.
